Memory module and memory system having the same
AssigneeSamsung Electronics Co., Ltd.
InventorsIn-su Choi, Joon-hee Lee, Hee-joo Choi, Il-guy Jung
Life of this patent
Estimating the term…
Abstract
A memory module and a memory system are provided. The memory module includes a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory chip is mounted, and a flexible coupler electrically connecting the first circuit board to the second circuit board. The memory module is bendable and is configured to extend around a memory controller. The memory chips are electrically coupled with the memory controller via a respective plurality of signal lines. The bendable memory module is configured to be bent around the memory controller such that respective lengths of the signal lines are equal.
Claims9
A memory system comprising:
- a memory controller;
- and
- a bendable memory module comprising a first circuit board on which at least one memory chip is mounted, a second circuit board on which at least one memory chip is mounted, and a flexible coupler which electrically connects the first circuit board to the second circuit board, wherein the plurality of memory chips mounted to the first and second circuit boards are electrically coupled with the memory controller via a respective plurality of signal lines, and wherein the bendable memory module is bent around the memory controller such that respective lengths of the signal lines are equal, wherein each of the first and second circuit boards comprises a module tap configured to receive data, and wherein memory chips on the first and second circuit boards receive data directly via the module tap.
Dependencies are inferred from the claim text.