Processor apparatus

An apparatus comprising:

• a case comprising air passages;
• a heat dissipation plate structure comprising a thermally conductive material within the case;
• a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;
• an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;
• a socket assembly;
• a circuit board, wherein the socket assembly is on the circuit board, wherein the pins in the array of pins are configured to be received in the socket assembly, and
• a biasing element operatively coupled to the processor.

An apparatus comprising:

• a case comprising air passages;
• a heat dissipation plate structure comprising a thermally conductive material within the case;
• a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;
• an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;
• a socket assembly;
• a circuit board, wherein the socket assembly is on the circuit board, wherein the pins in the array of pins are configured to be received in the socket assembly;
• and
• a biasing element comprising a pushing element operatively coupled to the processor.