Cooling assembly
AssigneeTelefonaktiebolaget L M Ericsson (publ)
InventorsGoran Aberg, Karl Gunnar Malmberg
Life of this patent
Estimating the term…
Abstract
A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic component by first being statically fixed to the circuit board in a stationary position at a specified height above the circuit board, and then by resiliently biasing the component against the heat sink.
Claims25
A method of cooling an electronic application having at least one heat-generating electronic component mounted on a printed circuit board, by means of a cooling assembly including a heat sink attached to the circuit board in heat transferring thermal contact with one heat generating electronic component, comprising the steps of:
- securing an outer area of the heat sink to the circuit board at a specified height above the circuit board and in a stationary position relative thereto;
- and
- applying biasing forces between the heat sink and the circuit board outside the component and through the heat sink acting as a fixed anvil;
- thereby enabling local resilient deformation of the circuit board in directions generally toward or away from the heat sink and establishing uniform and controlled contact pressure to ensure low thermal resistance between the heat sink and the component.
An electronic application comprising a circuit board, at least one heat-generating electronic component mounted thereon, and a cooling assembly comprising at least one rigid heat sink being in heat transferring thermal contact with a heat generating electronic component on the circuit board, wherein an outer area of the heat sink is secured to the circuit board in a statically fixed, stationary position relative thereto and at a specified height above the circuit board and in that the statically fixed heat sink is resiliently attached through a biasing force to the circuit board in an area outside the component.
A cooling assembly for cooling an electronic application of at least one heat generating electronic component mounted on a circuit board, including a heat sink having a thermal contact surface for making heat transferring thermal contact with a heat generating electronic component said cooling assembly comprising:
- first attachments for engaging the heat sink in an outer area thereof with regard to said heat transferring contact between the heat sink and a component, and for securing the heat sink to the circuit board in a statically fixed position relative thereto, at a specified height above the circuit board;
- and
- a second attachment having intermediary biasing means for resiliently attaching the statically fixed heat sink to the circuit board through biasing forces in an area thereof outside said heat transferring thermal contact.
A method of mounting a cooling assembly, to a circuit board for cooling an application of at least one heat generating electronic component mounted on the circuit board through heat transferring thermal contact between a rigid heat sink of the assembly and one component, said method comprising the steps of:
- securing the heat sink to the circuit board at first positions spaced outwardly from its contact with the electronic component, so as to be statically fixed relative thereto with a lower thermal contact surface thereof being provided at a specified distance from the circuit board at said positions;
- and
- attaching the statically fixed heat sink to the circuit board through a biasing force at second positions closely surrounding the electronic component.
Dependencies are inferred from the claim text.