Rotating disk storage device and integrated wire head suspension assembly

A rotating disk storage device, comprising:

• a rotating disk storage medium;
• a head/slider including a head for accessing the rotating disk storage medium and a slider mounted with the head;
• and
• a head suspension assembly including a mounting portion of the head/slider, wires connected to the head/slider, and a lead wiring pad forming an end portion of the wires;
• wherein the lead wiring pad includes a positioning portion configured to position in a vertical direction a solder ball relative to a centerline of the lead wiring pad, a through opening having the positioning portion as an edge, and an area of contact with the solder ball provided at an end part on a side of the head/slider in the through opening and
• wherein the end part has an inclined surface inclining, in a depth direction of the through opening, from a side, from which the solder ball is to be dropped, toward a portion away from the head/slider.

A rotating disk storage device, comprising:

• a rotating disk storage medium;
• a head/slider including a head for accessing the rotating disk storage medium and a slider mounted with the head;
• and
• a head suspension assembly including a mounting portion of the head/slider, wires connected to the head/slider, and a lead wiring pad forming an end portion of the wires;
• wherein the lead wiring pad includes a recess indented from a front surface of the lead wiring pad for positioning a solder ball used for connection to the head/slider, and an area of contact with the solder ball provided at an end portion on a side of the head/slider in the lead wiring pad and serving as an edge of the recess, and
• wherein the end portion has an inclined surface inclining, in a depth direction of the recess, from a side, from which the solder ball is to be dropped, toward a portion away from the head/slider.

An integrated wire head suspension assembly including a lead wiring pad formed on an end portion of a wiring pattern comprising:

• a metal layer;
• a dielectric layer laminated on the metal layer;
• and
• a conductor layer laminated on the dielectric layer;
• wherein the lead wiring pad includes a through slot for positioning a solder ball used for connection to slider mounted with a head for accessing a rotating disk storage medium, and
• wherein the through slot in the lead wiring pad includes a positioning portion configured to position the solder ball in a vertical direction relative to a centerline of the lead wiring pad, a through opening having the positioning portion as one edge, and an area of contact with the solder ball provided on an end portion of the lead wiring pad on a side of the head and forming another edge on the side of the head of the through opening.

An integrated wire head suspension assembly including a lead wiring pad formed on an end portion of a wiring pattern comprising:

• a metal layer;
• a dielectric layer laminated on the metal layer;
• and
• a conductor layer laminated on the dielectric layer;
• wherein the lead wiring pad includes a through slot for positioning a solder ball used for connection to a slider mounted with a head for accessing a rotating disk storage medium, and
• wherein the through slot has an end part on a side of the slider, the end part having an inclined surface inclining, in a depth direction of the through opening, from a side, from which the solder ball is to be dropped, toward a portion away from the slider.