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US 7,583,163 B2Granted
Acoustic wave filter and manufacturing method of the same
AssigneeRenesas Technology Corp.
InventorsYasuo Osone, Chiko Yorita, Yuji Shirai, Seiichi Tomoi
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AssigneeRenesas Technology Corp.
InventorsYasuo Osone, Chiko Yorita, Yuji Shirai, Seiichi Tomoi
Estimating the term…
A technique capable of integrally forming SMR type acoustic wave filters corresponding to multiple bands on the same chip at low cost is provided. In SMR type acoustic wave filters including multiple bandpass filters corresponding to multiple bands formed over the same die (substrate), acoustic multilayer films are formed without or with a minimum number of masks and piezoelectric thin films having different thicknesses for respective bands are collectively formed. For example, after the acoustic multilayer films (low acoustic impedance layers and high acoustic impedance layers) are formed in a deep groove in a terrace paddy field shape over the die in a maskless manner, the piezoelectric thin films are c-axis-oriented and grown, and are polished by CMP method or the like to be adjusted in a thickness for respective bands, and therefore, the SMR type acoustic wave filters for multiple bands are formed over the same chip.
An acoustic wave filter including multiple bandpass filters (BPF) formed over the same substrate corresponding to multiple bands, comprising:
A method of manufacturing an acoustic wave filter including multiple bandpass filters formed over the same substrate corresponding to multiple bands, comprising:
An acoustic wave filter including multiple bandpass filters formed over the same substrate corresponding to multiple bands, comprising:
A method of manufacturing an acoustic wave filter including multiple bandpass filters corresponding to multiple bands formed over the same substrate, comprising:
Dependencies are inferred from the claim text.