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US 7,583,162 B2Granted
Piezoelectric device and method for manufacturing the piezoelectric device
AssigneeEpson Toyocom Corporation
InventorYouji Nagano
Life of this patent
Estimating the term…
Abstract
A piezoelectric device includes a piezoelectric substrate having a connection pad, a package having an electrode pad, and a connection member to connect the electrode pad to the connection pad, the connection member being a metal member having a plurality of spherical metal particles connected to each other by sintering.
Claims6
A piezoelectric device, comprising:
- a piezoelectric substrate having a connection pad;
- a package having an electrode pad;
- and
- a connection member to connect the electrode pad to the connection pad, the connection member being a metal member having a plurality of spherical metal particles connected to each other by sintering,
- wherein the metal member has a porous structure, the porosity is created by an evaporated solvent.
2 more elements
A method for manufacturing a piezoelectric device, comprising:
- preparing a piezoelectric substrate having a connection pad;
- preparing a package having an electrode pad;
- applying a connection member having a plurality of spherical metal particles and a solvent on the electrode pad;
- mounting the piezoelectric substrate on the connection member;
- and
- sintering and combining the plurality of spherical metal particles each other,
- wherein the sintered and combined plurality of spherical metal particles have a porous structure, the step of sintering including evaporating a solvent to create the porosity.
4 more elements
Dependencies are inferred from the claim text.