Probing structure with fine pitch probes
AssigneeFormFactor, Inc.
InventorCharles A. Miller
Life of this patent
Estimating the term…
Abstract
A microelectronic resilient structure can comprise a support member and a platform attached to the support member. The platform can comprise a non-conductive, resilient beam that extends away from the support member, and a plurality of conductive members can be disposed on the beams. The conductive members can extend along a length of the beam. A plurality of conductive contact elements can be disposed on the beam and electrically connected to one of the conductive members.
Claims30
A microelectronic resilient structure comprising:
- a substrate comprising a surface;
- a support member attached at a first end to the surface of the substrate and extending away from the substrate to a second end;
- a platform attached to the second end of the support member and comprising a non-conductive, resilient beam that is suspended above, spaced apart from, and generally parallel to the surface of the substrate, wherein the beam extends away from the support member to a free end of the beam that is rotatable toward the surface of the substrate;
- a plurality of conductive members disposed on and extending along a length of the beam;
- and
- a plurality of conductive contact elements each disposed on the beam adjacent the free end of the beam and electrically connected to one of the conductive members.
A probe card assembly comprising:
- a first substrate comprising a surface;
- a platform comprising a base and a plurality of cantilevered beams, each of the beams being suspended above, spaced apart from, and substantially parallel to the surface of the substrate and extending from the base to a free end of the beam that is rotatable toward the surface of the substrate, the base and the beams being substantially electrically insulating;
- a plurality of support members, wherein each of the support members is attached at a first end to the surface of the first substrate and extends away from the surface to a second end that is attached to the base of the platform;
- a plurality of conductive test probes attached to and extending along a length of multiple ones of the beams, each test probe comprising a conductive trace and a conductive contact element, wherein at least one of the beams has disposed thereon at least two of the probes;
- an electrical interface to a tester;
- and
- electrical connections between the electrical interface and the first substrate.
A method for testing a semiconductor device with a contactor device that comprises a substrate and a plurality of support members extending from a surface of the substrate, the contactor device further comprising a platform comprising a base attached to distal ends of the support members and a plurality of cantilevered beams, each of the beams being suspended above, spaced apart from, and substantially parallel to the surface of the substrate and extending from the base to a free end of the beam, the method comprising:
- bringing probes of the contactor device into contact with terminals of the semiconductor device, the probes disposed on the beams, wherein at least two probes are disposed on at least one of the beams, the contact causing the free end of the at least one of the beams to rotate toward the surface of the substrate;
- providing test signals through ones of the probes to ones of terminals of the semiconductor device;
- and
- sensing response signals generated by the semiconductor device in response to the test signals at others of the probes in contact with others of the terminals of the semiconductor device.
The method of 24, wherein:
- the at least one of the beams twists about a first axis, providing compliance locally to each probe on the beam, and
- the at least one of the beams bends about a second axis different than the first axis, providing global compliance to the probes on the beam.
Dependencies are inferred from the claim text.