Contactor nest for an IC device and method

An improved contactor nest for holding IC devices having contact pads against a pin board interposer having an array of conductive spring pins with protruding plunger ends, said contactor nest comprising:

• a perimeter frame having a top and a bottom, and
• an IC pocket in and accessible from the top of said frame for receiving a size-compatible IC device with a defined footprint, said pocket having a top opening which is oversized in relation to the footprint of the IC device, an IC insertion axis, an IC seating plane which is perpendicular to said IC insertion axis and which defines the bottom of said pocket, and a bottom perimeter portion at said IC seating plane which corresponds to the footprint of the IC device, the bottom of said IC pocket being adapted to receive the pin board interposer such that the protruding plunger ends of the spring pins of the pin board interposer extend upwardly into said IC pocket from said seating plane,
• said IC pocket further including guide walls for guiding an IC device into said IC pocket from the oversize top opening thereof to said IC seating plane, said guide walls including an IC device centering section having a gradual angle relative to said insertion axis, said centering section of the guide walls extending down to the bottom perimeter portion of said pocket at said seating plane for gradually centering the IC device in said pocket as the IC device approaches said IC seating plane, said IC device centering section having a depth that causes the contact pads of an IC device that advances through said centering section to contact the plunger ends of the spring pins of the pin board interposer before the IC device travels the full depth of said centering section.