High-density probe array
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-Chul Yoo, Byoung-Jae Bae, Jang-Eun Heo, Ji-Eun Lim, Dong-Hyun Im
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Abstract
A probe array may be fabricated by forming probes arranged on a sacrificial substrate, forming a probe substrate above the probes, and removing the sacrificial substrate. In one embodiment, first probes may be two-dimensionally formed in row and column directions on a sacrificial substrate. Second probes may be formed between the first probes arranged in the row direction such that a distance between the first and second probes is smaller than the resolution limit in a lithography process. A probe substrate may be formed on the sacrificial substrate having the first and second probes, and the sacrificial substrate may be removed.
Claims16
A method of fabricating a probe array, comprising:
- forming a mold insulating layer on a sacrificial substrate;
- first patterning the mold insulating layer, thereby forming first holes exposing the sacrificial substrate;
- forming a first conductive layer on the sacrificial substrate having the first holes;
- first planarizing the first conductive layer, thereby forming first probes arranged two-dimensionally in row and column directions on a sacrificial substrate;
- second patterning the mold insulating layer, thereby forming second holes exposing the sacrificial substrate;
- forming a second conductive layer on the sacrificial substrate having the second holes;
- second planarizing the second conductive layer, thereby forming second probes between the first probes arranged in the row direction;
- forming a probe substrate above the first and the second probes;
- and
- removing the sacrificial substrate.
A method of fabricating a probe array, comprising:
- forming a first mold insulating layer on a sacrificial substrate;
- forming first probes penetrating the first mold insulating layer;
- forming first metal interconnections to cover the first probes arranged in a column direction;
- forming a second mold insulating layer on the sacrificial substrate having the first metal interconnections;
- forming second probes between the first probes arranged in a row direction, wherein the respective second probes are formed through the second mold insulating layer and the first mold insulating layer;
- and
- forming second metal interconnections to cover the second probes arranged in the column direction, wherein the second metal interconnections are formed on a level different from the first metal interconnections and are spaced apart from the first metal interconnections.
A probe array comprising:
- first probes arranged two-dimensionally in row and column directions;
- second probes disposed between the first probes arranged in the row direction;
- a probe substrate disposed on the first and second probes;
- first metal interconnections disposed between the probe substrate and the first probes arranged in the column direction;
- second metal interconnections disposed between the probe substrate and the second probes arranged in the column direction;
- and
- insulating spacers disposed between the first metal interconnections and the second metal interconnections.
A probe array comprising:
- first probes arranged two-dimensionally in row and column directions;
- second probes disposed between the first probes arranged in the row direction, wherein each of the first probes has a first height, and each of the second probes has a second height greater than the first height;
- a probe substrate disposed on the first and second probes;
- first metal interconnections disposed between the probe substrate and the first probes arranged in the column direction;
- and
- second metal interconnections disposed between the probe substrate and the second probes arranged in the column direction, wherein the second metal interconnections are disposed on a level different from the first metal interconnections and are spaced apart from the first metal interconnections.
Dependencies are inferred from the claim text.