Electrical test method of an integrated circuit
AssigneeSTMicroelectronics S.r.l.
InventorFrancois Tailliet
Life of this patent
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Abstract
A method for testing an integrated circuit is provided comprising steps of providing at least one first conductive path stretching along an element of the integrated circuit, applying a voltage at a point of the first conductive path, performing a first measurement of the voltage at a point of the first conductive path, and determining whether the integrated circuit is damaged according to the result of the first measurement. Application to the detection of damage due to the sawing or electrical testing of integrated circuits.
Claims39
A method for testing an integrated circuit, the method comprising:
- providing a first conductive path in the integrated circuit, the first conductive path being adjacent to and not electrically connected to an element of the integrated circuit being tested;
- applying a voltage at a first point of the first conductive path using a test circuit included in the integrated circuit;
- performing a first voltage measurement at a second point of the first conductive path using the test circuit;
- applying a voltage to the element of the integrated circuit;
- performing a second voltage measurement at the second point of the first conductive path;
- and
- determining, based on at least one of the first voltage measurement and using the test circuit, and the second voltage measurement, whether the element of the integrated circuit is damaged.
An integrated circuit comprising:
- an element being tested;
- a first conductive path adjacent to and not electrically connected to the element being tested;
- and
- a test circuit configured for:
- applying a voltage at a first point of the first conductive path;
- performing a first voltage measurement at a second point of the first conductive path;
- applying a voltage to the element of the integrated circuit;
- performing a second voltage measurement on the second conductive path;
- and
- determining, based on at least one of the first voltage measurement and the second voltage measurement, whether the element of the integrated circuit is damaged.
An integrated circuit comprising:
- a test element;
- a first test conductor adjacent to and not electrically connected to the test element;
- a second test conductor situated under the first test conductor and not electrically connected to the test element;
- and
- test means, connected to the first test conductor, for determining whether the test element is damaged by measuring an electrical quantity of the first test conductor, wherein the test means are configured to perform a plurality of damage tests by sequentially applying a plurality of test voltages to a plurality of test contacts of the first and second test conductors.
A method for testing an integrated circuit, the method comprising:
- providing a first conductive path in the integrated circuit, the first conductive path being adjacent to and not electrically connected to an element of the integrated circuit being tested;
- providing a second conductive path adjacent to and not electrically connected to the element;
- applying a voltage at a first point of the first conductive path using a test circuit included in the integrated circuit;
- applying a voltage to the element of the integrated circuit;
- performing a first voltage measurement at a second point of the first conductive path using the test circuit;
- performing a second voltage measurement at a first point of the second conductive path;
- and
- determining, based at least on one of the first voltage measurement and using the test circuit, and the second voltage, whether the element of the integrated circuit is damaged.
An integrated circuit comprising:
- an element being tested;
- a first conductive path adjacent to and not electrically connected to the element being tested;
- a second conductive path adjacent to and not electrically connected to the element;
- and
- a test circuit configured for:
- applying a voltage at a first point of the first conductive path;
- applying a voltage to the element of the integrated circuit;
- performing a first voltage measurement at a second point of the first conductive path;
- performing a second voltage measurement on the second conductive path;
- and
- determining, based on at least one of on the first voltage measurement and the second voltage measurement, whether the element of the integrated circuit is damaged.
Dependencies are inferred from the claim text.