Package of surface-mountable electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKeiichi Kami, Mitsunori Ishimasa, Manabu Sumita
Life of this patent
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Abstract
A package of a surface-mountable electronic component to be reflow-soldered to a circuit board at about 250° C. or more includes a case and a cover. The cover has a softening temperature lower than the reflow temperature, and the case has a softening temperature higher than the reflow temperature. In the package, softening the cover compensates for the stress on the bonded surfaces resulting from a difference in thermal expansion between the case and the cover caused during reflow.
Claims20
A package of a surface-mountable electronic component to be reflow-soldered to a circuit board at a reflow temperature of about 250° C. or more, the package comprising:
- a case with an opening, holding an element of the electronic component therein, the case having a softening temperature that is higher than the reflow temperature;
- and
- a cover bonded to the case so as to close the opening, the cover having a softening temperature that is lower than the reflow temperature;
- wherein
- the case is made of an insulative material;
- the cover is made of a resin;
- and
- the cover is bonded to the case with an adhesive.
An electronic apparatus comprising:
- an electronic component;
- and
- a package containing the electronic component and arranged to be reflow-soldered to a circuit board at a reflow temperature of about 250° C. or more, the package including a case with an opening, holding an element of the electronic component therein, the case having a softening temperature that is higher than the reflow temperature, and a cover bonded to the case so as to close the opening, the cover having a softening temperature that is lower than the reflow temperature;
- wherein
- the case is made of an insulative material;
- the cover is made of a resin;
- and
- the cover is bonded to the case with an adhesive.
Dependencies are inferred from the claim text.