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AssigneeSharp Kabushiki Kaisha
InventorsToshiharu Seko, Kenji Toyosawa
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The present invention provides a semiconductor device tape carrier formed of an insulative tape 1 of a thin film, which becomes a semiconductor device by conducting a plurality of wire patterns 11 on its surface to a bump 23 of a semiconductor element 21 and being sealed by an insulative resin 22, wherein: an outer dimension of the semiconductor device in a carriage direction of the insulative tape 1 is greater than an integral multiple X (X=1, 2, 3, 4, 5, . . . ) of a pitch interval of sprocket holes 2, which are openings formed to carry the insulative tape 1, and not more than: the integral multiple X+a decimal Y (0<Y<1), and the tape pitch for a single semiconductor device is set to the integral multiple X+a decimal Y (0<Y<1). In this way, the manufacturing method for semiconductor device, the semiconductor device, and the semiconductor module device for a tape carrier type semiconductor device according to the present invention reduces an unformed region of the insulative tape 1 which is irrelevant to the outer dimension of the semiconductor device.
A semiconductor device tape carrier formed of an insulative tape of a thin film, which becomes a semiconductor device by conducting a plurality of wire patterns on its surface to a protruding electrode of a semiconductor element and being sealed by an insulative resin, comprising:
A semiconductor device composed of a semiconductor device tape carrier formed of an insulative tape of a thin film, which becomes a semiconductor device by conducting a plurality of wire patterns on its surface to a protruding electrode of a semiconductor element and being sealed by an insulative resin, comprising:
A semiconductor module device made of a semiconductor device composed of a semiconductor device tape carrier formed of an insulative tape of a thin film, which becomes a semiconductor device by conducting a plurality of wire patterns on its surface to a protruding electrode of a semiconductor element and being sealed by an insulative resin, comprising:
A semiconductor device tape carrier comprising:
A semiconductor device composed of a semiconductor device tape carrier comprising:
A semiconductor module device made of a semiconductor device composed of a semiconductor device tape carrier comprising:
Dependencies are inferred from the claim text.