US 7,582,974 B2 · Semiconductor device and method of manufacturing same

Abstract

A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted; a bonding agent for bonding the semiconductor chip to the die pad; a plurality of inner leads provided at the outer periphery of the die pad; outer leads extending from the inner leads; bonding wires connecting the inner leads to the semiconductor chip mounted on the die pad; and a resin for sealing the inner leads, the die pad, the semiconductor chip, the bonding agent and the bonding wires. The bonding agent is further disposed in all or part of a margin of the die pad at a peripheral portion where the semiconductor chip is mounted, and a plurality of dimples are formed in the surface of the bonding agent in the die pad margin.

Claims16

Dependent claims

A semiconductor device comprising:

a semiconductor chip;
a die pad on which said semiconductor chip is mounted;
a bonding agent bonding said semiconductor chip to said die pad;
and
a resin sealing an assembly comprising at least said die pad, said semiconductor chip and said bonding agent;
wherein said bonding agent is placed on at least a part of a margin of the die pad on a side thereof that faces said semiconductor chip, and a plurality of dimples are formed in the surface of said bonding agent and are filled by said resin.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method of manufacturing same

Life of this patent

Semiconductor device and method of manufacturing same

Life of this patent

Abstract

Claims16