Flip-chip type assembly
AssigneeNEC Corporation
InventorHiroyuki Hamaguchi
Life of this patent
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Abstract
A structure for sufficiently alleviating the thermal stress between an LSI and substrate and allowing the LSI to be detached from a substrate easily is provided. In a flip-chip type assembly according to the present invention, an interposer made of silicon intervenes between the device and the substrate. The LSI and the interposer are connected with a solder and, the interposer and the substrate are connected with a conductive resin. The conductive resin alleviates the thermal stress between the substrate and the interposer. The LSI can be detached easily by heating the solder. The thermal stress between the LSI and the interposer can be reduced because both of them are made of silicon.
Claims15
A flip-chip type assembly comprising:
- a substrate;
- an interposer;
- a semiconductor chip;
- a first resin electrically connecting said substrate and said interposer, wherein said first resin has elasticity;
- a second resin intervening between said substrate and said interposer, said second resin having a less electrical conductivity than said first resin, and
- a solder electrically connecting said interposer and said semiconductor chip.
A flip-chip type assembly comprising:
- a substrate;
- an interposer;
- a semiconductor chip;
- a first resin electrically connecting said substrate and said interposer, wherein said first resin has elasticity;
- a second resin intervening between said substrate and said interposer, said second resin having a less electrical conductivity than said first resin, and
- a connecting member electrically connecting said interposer and said semiconductor chip, wherein said connecting member is removable by heating.
A flip-chip type assembly comprising:
- a substrate;
- an interposer;
- a semiconductor chip;
- a first resin electrically connecting said substrate and said interposer, wherein said first resin has elasticity, and
- a solder electrically connecting said interposer and said semiconductor chip, wherein an elasticity modulus of said first resin is from about 1 MPa to about 3 MPa.
A flip-chip type assembly comprising:
- a substrate;
- an interposer;
- a semiconductor chip;
- a first resin electrically connecting said substrate and said interposer, wherein said first resin has elasticity, and
- a connecting member electrically connecting said interposer and said semiconductor chip, wherein said connecting member is removable by heating, wherein an elasticity modulus of said first resin is from about 1 MPa to 3 MPa.
Dependencies are inferred from the claim text.