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US 7,582,963 B2Granted
Vertically integrated system-in-a-package
AssigneeTexas Instruments Incorporated
InventorsMark A. Gerber, Wyatt Huddleston
Life of this patent
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Abstract
According to one embodiment of the invention, a method of forming a system-in-a-package includes providing a first substrate, coupling a first die to a top surface of the first substrate, coupling one or more surface mount devices to a top surface of a second substrate, coupling the second substrate to a top surface of the first die, interconnecting the first substrate, the second substrate, and the first die, and encapsulating the first die, the second substrate and the surface mount devices.
Claims5
A system-in-a-package, comprising:
- a first substrate having a top surface;
- a first die coupled to the top surface of the first substrate;
- one or more passive surface mount devices coupled to a top surface of a second substrate;
- and
- a second die having a top surface coupled to the second substrate and an opposite surface coupled to a top surface of the first die;
- wherein the first and second substrates, the first and second die are directly electrically coupled together with a plurality of wirebonds;
- and
- the first and second die, the second substrate and the surface mount devices are encapsulated with a mold compound.
5 more elements
Dependencies are inferred from the claim text.