Package structure with circuits directly connected to semiconductor chip

A packaging structure with circuits directly connected to a semiconductor chip, comprising:

• a carrier board having a through cavity;
• a semiconductor chip disposed in the through cavity of the carrier board, which has an active surface, wherein a plurality of electrode pads are disposed on the active surface;
• at least one built-up structure disposed on the surface of the carrier board on the same side as the active surface of the semiconductor chip, which comprises a dielectric layer of which part surface is revealed by the through cavity of the carrier board, wherein a plurality of circuit layers and conductive structures are located on and in the dielectric layer, and the electrode pads of the semiconductor chip are conducted by parts of the conductive structures to the circuit layers;
• and
• an adhesive material formed on the part surface of the dielectric layer revealed by the through cavity and on a lateral surface of the semiconductor chip, but without contacting to the carrier board.