Back to results
US 7,582,960 B2Granted
Multiple chip package module including die stacked over encapsulated package
AssigneeSTATS ChipPAC, Ltd.
InventorMarcos Karnezos
Life of this patent
Estimating the term…
Abstract
A module having multiple die includes a first package (such as a land grid array package) inverted and mounted upon a lower substrate, and one or more die mounted or stacked over the upward-facing side of the inverted package.
Claims14
A multiple chip package module comprising:
- a module having a substrate and a package encapsulant on the substrate;
- a first package comprising:
- a first package substrate having a die mount side and a land side,
- a first package die mounted on the die mount side of the first package substrate,
- a first encapsulant covering the first package die and the die mount side of the first package substrate, and
- the first package being inverted and supported by the first encapsulant on the package encapsulant over a first side of the module substrate;
- wire bonds connecting a land side of the first package substrate with the first side of the module substrate;
- and
- a module encapsulant covering the land side.
6 more elements
Dependencies are inferred from the claim text.