Driver module structure with flexible circuit board
AssigneePanasonic Corporation
InventorHiroyuki Fukusako
Life of this patent
Estimating the term…
Abstract
A driver module structure includes a flexible circuit board (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible circuit board (2), and an electrically conductive heat-radiating member (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8). The flexible circuit board (2) has a cavity (9) that exposes a portion of the ground wiring pattern (8). The exposed portion of the ground wiring pattern (8) and the heat-radiating member (4) are connected to establish electrical continuity via a member (11) that is fitted into the cavity (9).
Claims2
A driver module structure comprising:
- a flexible circuit board provided with a wiring pattern;
- a semiconductor device mounted on the flexible circuit board;
- and
- an electrically conductive heat-radiating member joined to the semiconductor device,
- wherein the wiring pattern comprises a ground wiring pattern,
- the flexible circuit board has a cavity that exposes a portion of the ground wiring pattern,
- the exposed portion of the ground wiring pattern and the heat-radiating member are connected to establish electrical continuity via a member that is fitted into the cavity, and
- the cavity is a through hole penetrating the ground wiring pattern, a portion of the ground wiring pattern on an opposite side from the heat-radiating member is exposed, and the member fitted into the cavity is an electrically conductive screw that fastens the flexible circuit board and the heat-radiating member and provides electrical continuity between the exposed portion of the ground wiring pattern and the heat-radiating member.
Dependencies are inferred from the claim text.