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US 7,582,957 B2Granted
Integrated circuit package system with encapsulation lock
AssigneeSTATS ChipPAC, Ltd.
InventorLionel Chien Hui Tay
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system is provided including forming a paddle having holes with a hole size in a range about tens to hundreds of micrometers, mounting a device over the paddle, and filling an encapsulation in the holes.
Claims16
An integrated circuit package system comprising:
- forming a paddle having a groove with holes through the groove, the holes having a hole size in a range about tens to hundreds of micrometers and the paddle having a plating at a peripheral region of the paddle;
- mounting a device over the paddle;
- and
- filling an encapsulation in the holes.
1 more element
An integrated circuit package system comprising:
- forming a die-attach paddle having holes with a diameter in a range about tens to hundreds of micrometers and a ratio of the diameter and a separation between the holes in a range about 1:2 to 2:1;
- mounting an integrated circuit die over the die-attach paddle;
- and
- filling an encapsulation in the holes.
1 more element
An integrated circuit package system comprising:
- a paddle having a groove and holes through the groove, the holes having a hole size in a range about tens to hundreds of micrometers and the paddle having a plating at a peripheral region of the paddle;
- a device over the paddle;
- and
- an encapsulation in the holes.
1 more element
Dependencies are inferred from the claim text.