Package structure with leadframe on offset chip-stacked structure

A package structure with leadframe on chip-stacked structure, comprising:

• a leadframe, composed of a plurality of outer leads and a plurality of inner leads formed by a plurality of wires, wherein said plurality of inner leads are divided into a plurality of first inner leads and a plurality of second inner leads and the length of said plurality of first inner leads is greater than that of said plurality of second inner leads, lower surface of said plurality of first inner leads being provided with an adhesive;
• a chip-stacked structure stacked by a plurality of chips, a back surface of each said chip being provided with an adhesive for adhering said plurality of chips in pairs to form an offset stacked structure with an active surface of said chips facing upward, wherein said plurality connected under said plurality of first inner leads and said chip-stacked structure is electrically connected with said plurality of first inner leads and said plurality of second inner leads on same side edge;
• and
• an encapsulant covering said chip-stacked structure and said lead-frame, said plurality of outer leads extending out of said encapsulant.

A package structure with leadframe on chip-stacked structure, comprising:

• a lead-frame, composed of a plurality of outer leads and a plurality of inner leads formed by a plurality of wires, wherein said plurality of inner leads are divided into a plurality of first inner leads and a plurality of second inner leads and the length of said plurality of first inner leads is greater than that of said plurality of second inner leads;
• a chip-stacked structure stacked by a plurality of chips, an active surface of each said chip being provided with an adhesive for adhering said plurality of chips in pairs to form an offset stacked structure with said active surface of said plurality of chips facing upward, wherein said plurality of chip stacked uppermost in said chip-stacked structure is fixedly connected under said plurality of first inner leads and said plurality of chips is electrically connected with said plurality of first inner leads and said plurality of second inner leads on same side edge;
• and
• an encapsulant covering said chip-stacked structure and said lead-frame, said plurality of outer leads extending out of said encapsulant.