Mounting and adhesive layer for semiconductor components
AssigneeInfineon Technologies AG
InventorsMelanie Ring, Benjamin Prodinger, Werner Kuhlmann
Life of this patent
Estimating the term…
Abstract
An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).
Claims13
A conductive adhesive connection between a silicon carrier and an electronic functional element, said connection for adhesively mounting and forming an electrically conducting connection between the silicon carrier and the functional element, the conductive adhesive connection comprising:
- an oxidation free aluminum contact surface on the silicon carrier;
- a Ti/Ti-nitride layer applied by a deposition process to and in contact with the oxidation free aluminum contact surface, the aluminum contact surface being located on a landing pad of the silicon carrier, said landing pad being separate and distinct from said oxidation free aluminum contact surface;
- and
- a conductive adhesive between and in contact with both the Ti/Ti-nitride layer and the functional element.
An electrical component comprising:
- a carrier having a first contact and a second contact;
- a landing pad having an oxidation free aluminum contact surface electrically connected to the first contact, said landing pad being separated and distinct from said aluminum contact surface;
- a Ti/TiN layer overlying and in contact with the aluminum contact surface that is connected to the first contact;
- a conductive adhesive layer disposed on and in contact with said Ti/TiN layer;
- and
- an electronic functional element comprising a first electrode and a second electrode, wherein the first electrode is in direct physical contact with and electrically connected to the Ti/TiN layer and mechanically connected to the carrier by said electrically conductive adhesive layer and wherein the second electrode is wire bonded to the second contact.
Dependencies are inferred from the claim text.