Printed circuit board having reduced mounting height
AssigneeDongbu Electronics Co., Ltd.
InventorKwan Yul Lee
Life of this patent
Estimating the term…
Abstract
A printed circuit board including an opening for receiving a semiconductor package having a plurality of external connections which protrude externally from side surfaces of the semiconductor package. The board also includes a plurality of board connectors electrically interconnected to the plurality of external connections of the package and formed on sidewall of the opening, wiring patterns for electrically interconnect electronic components mounted on the printed circuit board and being electrically interconnected to the plurality of board connectors, a plurality of holes penetrating the printed circuit board, and a fastener inserted into the plurality of holes and for fastening the semiconductor package received in the opening.
Claims12
A printed circuit board comprising:
- an opening configured to receive a semiconductor package having a plurality of external connections which protrude externally from side surfaces of the semiconductor package;
- a plurality of board connectors electrically interconnected to the plurality of external connections of the package and formed on a sidewall of the opening;
- wiring patterns for electrically interconnect electronic components mounted on the printed circuit board and being electrically interconnected to the plurality of board connectors;
- a plurality of holes penetrating the printed circuit board;
- and
- fastening means inserted into the plurality of holes and for fastening the semiconductor package received in the opening,
- wherein the opening is formed to penetrate the printed circuit board.
A printed circuit board comprising:
- an opening configured to receive a semiconductor package having a plurality of external connections which protrude externally from side surfaces of the semiconductor package;
- a plurality of board connectors electrically interconnected to the plurality of external connections of the package and formed on a sidewall of the opening;
- wiring patterns for electrically interconnect electronic components mounted on the printed circuit board and being electrically interconnected to the plurality of board connectors;
- a plurality of holes penetrating the printed circuit board;
- and
- a fastener inserted into the plurality of holes and configured to fasten the semiconductor package received in the opening,
- wherein the opening is formed to penetrate the printed circuit board.
Dependencies are inferred from the claim text.