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US 7,582,832 B2Granted
Bond and method for bonding two contact surfaces
AssigneeRobert Bosch GmbH
InventorsManfred Reinold, Thomas Kaden, Immanuel Mueller
Life of this patent
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Abstract
A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.
Claims10
A bond between two contact surfaces comprising:
- at least two bonding wires, each of the at least two bonding wires having at least two free ends, the bonding wires being situated one above the other and being conductively interconnected at the at least two free ends of each bonding wire;
- wherein the at least two free ends of each bonding wire are located at the contact surfaces;
- and
- wherein the bonding wires are welded to one another.
1 more element
A bond between two contact surfaces comprising:
- at least two bonding wires, each of the at least two bonding wires having at least two free ends, the bonding wires being situated one above the other and being conductively interconnected at the at least two free ends of each bonding wire;
- wherein the at least two free ends of each bonding wire are located at the contact surfaces;
- wherein the bonding wires are joined to each other at at least two locations set apart from each other in a longitudinal direction of the bonding wires, in an area of free ends;
- and
- wherein the joining is by welding.
2 more elements
Dependencies are inferred from the claim text.