Process and composition for conductive material removal by electrochemical mechanical polishing

A method of processing a substrate having a conductive material layer disposed thereon, comprising:

• providing the substrate to a process apparatus;
• exposing the substrate to a first polishing composition;
• contacting the substrate to a polishing article;
• providing relative motion between the substrate and the polishing article;
• applying a first bias to the substrate;
• removing at least 50% of the conductive material layer;
• exposing the substrate to a second polishing composition initially comprising:
• an acid based electrolyte;
• a chelating agent;
• a corrosion inhibitor;
• a passivating polymeric material;
• a basic pH adjusting agent in an amount sufficient to provide a pH between about 3 and about 10;
• and
• a solvent;
• and
• contacting the substrate to the polishing article;
• providing relative motion between the substrate and the polishing article;
• applying a second bias to the substrate;
• and
• removing the conductive layer.

A method of processing a substrate, comprising:

• disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising a first electrode and a second electrode, wherein the substrate is in electrical contact with the second electrode;
• providing a polishing composition between the first electrode and the substrate wherein the polishing composition initially comprises:
• about 5.1% by volume phosphoric acid;
• about 2% by weight ammonium citrate;
• about 0.3% by weight of benzotriazole;
• about 0.025% by volume of 750000 molecular weight polyetheyleneimine;
• potassium hydroxide to provide a pH of about 5.75;
• and
• the remainder deionized water;
• contacting the substrate to a polishing article;
• providing relative motion between the substrate and the polishing article;
• applying a bias between the first electrode and the second electrode;
• and
• removing conductive material from the substrate surface.