US 7,582,552 B2Granted

Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering

AssigneeDenso Corporation

InventorsMasashi Yamasaki, Mutsumi Yoshino

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Abstract

In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy of previously selected metal materials and placed on the one surface of at least one busbar. The solder joint is changed from a molten state to a solid state to thereby mechanically and electrically connect an electronic component to the one surface of the at least one busbar. The at least one previously selected metal material of the at least one busbar and the previously selected metal materials of the alloy of the solder joint determine that a contact angle of the molten solder joint to the one surface of the at least one busbar is within an angular range of 40 to 60 degrees.

Claims18

Dependent claims

An electronic apparatus comprising:

an electronic component;
a busbar assembly composed of a plurality of busbars made of at least one previously selected metal material, each of the plurality of busbars having one surface, the plurality of busbars being arranged to be assembled so as to constitute a predetermined circuit pattern;
and
a solder joint made of an alloy of previously selected metal materials and placed on the one surface of at least one of the plurality of busbars, the solder joint being changed from a molten state to a solid state to thereby mechanically and electrically connect the electronic component to the one surface of the at least one of the plurality of busbars, the at least one previously selected metal material of the at least one of the plurality of busbars and the previously selected metal materials of the alloy of the solder joint determining that a contact angle of the solder joint in the molten state with respect to the one surface of the at least one of the plurality of busbars is within an angular range of 40 to 60 degrees.

1 more element

A method of manufacturing an electronic apparatus comprising:

preparing an electronic component;
selecting at least one metal material so as to prepare a busbar assembly composed of a plurality of busbars made of the at least one selected metal material, each of the plurality of busbars having one surface, the plurality of busbars being arranged to be assembled so as to constitute a predetermined circuit pattern;
selecting an alloy of metal materials so as to form a solder joint made of the selected alloy of metal materials;
and
placing the solder joint on the one surface of at least one of the plurality of busbars;
and
changing the solder joint placed on the one surface of the at least one of the plurality of busbars from a molten state to a solid state to thereby mechanically and electrically connect the electronic component to the one surface of the at least one of the plurality of busbars, the at least one selected metal material of the at least one of the plurality of busbar and the selected alloy of metal materials of the solder joint determining that a contact angle of the solder joint in the molten state with respect to the one surface of the at least one of the plurality of busbars is within an angular range of 40 to 60 degrees.

4 more elements

Dependencies are inferred from the claim text.