Die attaching method
AssigneeSamsung Electronics Co., Ltd.
InventorsDae-Young Kim, Joung-Min Oh
Life of this patent
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Abstract
A die attaching method for attaching semiconductor dies on wafers, each wafer having a first center point and a first radius may include expanding a wafer carrier tape so that the wafer has a second center point and a second radius, measuring the second center point and second radius of the wafer, adding the difference between the first radius and the second radius to a first coordinate value of a first die to calculate a second coordinate value of the first die, and picking up and attaching the semiconductor dies consecutively from the first die. Calculating the second coordinate value of the first die may include compensating the first center point of the wafer based on the second center point of the wafer to calculate the positional coordinate of the semiconductor dies including the first die.
Claims14
A die attaching method for attaching semiconductor dies of a plurality of wafers, each wafer having a first center point and a first radius, the method comprising:
- mounting a wafer having semiconductor dies including a reference semiconductor die on a wafer carrier tape;
- expanding the wafer carrier tape so that the wafer has a second center point and a second radius;
- measuring the second center point and the second radius of the wafer;
- adding the difference between the first radius and the second radius to a first coordinate value of the reference semiconductor die to calculate a second coordinate value of the reference semiconductor die;
- and
- picking up and attaching the remainder of the semiconductor dies consecutively from the reference semiconductor die.
A method for aligning a wafer for die attaching, the method comprising:
- obtaining the wafer including at least one semiconductor die;
- mounting the wafer on a wafer carrier tape;
- obtaining an unstretched wafer center point and an unstretched wafer radius;
- stretching the wafer carrier tape upon which the wafer is mounted;
- obtaining a stretched wafer center point and a stretched wafer radius, wherein obtaining the stretched wafer center point and the stretched wafer radius comprises recognizing edge images and calculating the stretched wafer center point and the stretched wafer radius from coordinate values of the edge images;
- and
- calculating a position of the semiconductor die based at least in part on the unstretched wafer radius and the stretched wafer radius.
A method for aligning a wafer for die attaching, the method comprising:
- obtaining the wafer including at least one semiconductor die;
- mounting the wafer on a wafer carrier tape;
- obtaining an unstretched wafer center point and an unstretched wafer radius;
- stretching the wafer carrier tape upon which the wafer is mounted;
- obtaining a stretched wafer center point and a stretched wafer radius;
- and
- calculating a position of the semiconductor die based at least in part on the unstretched wafer radius and the stretched wafer radius, wherein calculating the position of the semiconductor die comprises adding the difference between the stretched wafer radius and the unstretched wafer radius to a reference position.
Dependencies are inferred from the claim text.