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US 7,582,537 B2Granted
Zener diode and methods for fabricating and packaging same
AssigneeLG Electronics Inc.
InventorsKi Chang Song, Geun Ho Kim
Life of this patent
Estimating the term…
Abstract
A zener diode and methods for fabricating and packaging same are disclosed, whereby contact hole forming process exposing a diffusion layer is removed to enable to simplify the fabricating process, and the diffusion length not contacting the electrode line is determined by the crosswise length toward which the impurity is diffused to enable to reduce the zener impedance value. Furthermore, wet etching is used following the diffusion to remove the diffusion masks such that no damage is given to the diffusion layers to thereby enable to improve the zener diode characteristics.
Claims14
A zener diode fabricating method comprising:
- sequentially forming an insulation films and mask layers on top and bottom surfaces of a substrate having a first polarity;
- sequentially etching part of the mask layer and the insulation film on the top surface of the substrate to form a pair of openings through which the substrate is exposed;
- implementing a diffusion process by introducing an impurity having a second polarity opposite to that of the first polarity into the top surface of the substrate to form mutually spaced diffusion layers having the second polarity at substrate regions exposed through the pair of openings;
- removing the mask layer on the top surface of the substrate to expose the insulation film, the mutually spaced diffusion layers exposed through the openings of the insulation film;
- and
- forming a pair of electrode lines each electrically connected to a respective one of the exposed diffusion layers.
3 more elements
A zener diode fabricating method comprising:
- sequentially forming an insulation film and a mask layer on top and bottom surfaces of a substrate having a first polarity;
- sequentially etching part of the mask layer and the insulation film on the top surface of the substrate to form a first opening through which the substrate is exposed;
- implementing a diffusion process by introducing an impurity having a second polarity opposite to that of the first polarity into the substrate to form a diffusion layer having the second polarity at a substrate region exposed by the opening;
- removing another part of the mask layer on the top surface of the substrate to expose the insulation film, the diffusion layer exposed through the first opening of the insulation film;
- etching another part of the insulation film spaced apart from the first opening to form a second opening through which the top surface of the substrate is exposed;
- forming on top of the insulation film a pair of electrode lines each electrically connected to a respective one of the diffusion layer exposed through the first opening and the top surface of the substrate exposed through the second opening.
3 more elements
A zener diode fabricating method comprising:
- sequentially forming insulation films on top and bottom surfaces of a substrate having a first polarity;
- etching part of a mask layer and the insulation film over the top surface of the substrate to form a pair of openings through which the substrate is exposed;
- introducing an impurity having a second polarity opposite to that of the first polarity into the substrate and implementing a diffusing process, and forming diffusion layers having the second polarity at respective substrate regions exposed through the pair of openings,
- forming property-changed layers on a top surface of the mask layer, and forming additional insulation films on the diffusion layers;
- removing the property-changed layers formed on the top surface of the mask layer and the additional insulation films formed on the diffusion layers;
- and
- forming on top of a remaining part of the insulation film on the top surface of the substrate a pair of electrode lines each electrically connected to a respective one of the diffusion layers exposed through the pair of openings.
4 more elements
A zener diode fabricating method comprising:
- sequentially forming an insulation film and a mask layer on top and bottom surfaces of a substrate having a first polarity,
- sequentially etching part of the mask layer and the insulation film on the top surface of the substrate to form a pair of openings through which the substrate is exposed,
- forming diffusion layers having a second polarity in respective substrate regions through which the openings are exposed,
- removing a another part of the mask layer on top surface of the substrate to expose another part of the insulation film, and
- forming first and second electrode lines each electrically connected to a respective one of the exposed diffusion layers to fabricate a device;
- preparing a Printed Circuit Board (PCB) packaged with first and second electrode terminals thereon and a Light Emitting Device (LCD) formed thereon,
- bonding the device on top of the PCB;
- wire-bonding a first electrode terminal of the PCB to the first one of the electrode lines of the device,
- wire-bonding the first one of the electrode lines of the device to a first electrode terminal of the LED,
- wire-bonding a second electrode terminal of the PCB to a second electrode terminal of the LED, and
- wire-bonding the second electrode terminal of the LED to the second one of the electrode lines of the device.
8 more elements
A zener diode packaging method comprising:
- sequentially forming an insulation film and a mask layer on top and bottom surfaces of a substrate having a first polarity,
- sequentially etching part of the mask layer and the insulation film to form a pair of openings through which the substrate is exposed,
- forming diffusion layers having a second polarity on respective substrate regions through which the openings are exposed,
- removing another part of the mask layer on the top surface of the substrate to expose another part of the insulation film,
- forming first and second electrode lines each electrically connected to a respective one of the exposed diffusion layers to fabricate a device;
- packaging the device to a Printed Circuit Board (PCB) formed thereon with first and second electrode terminals;
- flip-chip bonding a Light Emitting Device (LED) to the first and second electrode lines of the device;
- and
- wire-bonding the first electrode terminal of the PCB to the first electrode line of the device, and
- wire-bonding the second electrode line of the device to the second electrode terminal of the PCB.
7 more elements
Dependencies are inferred from the claim text.