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US 7,582,513 B2Granted
Electronic device and method for producing electronic devices
AssigneeInfineon Technologies AG
InventorsWerner Kroeninger, Franco Mariani
Life of this patent
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Abstract
One aspect includes an electronic device including an integrated component with a substrate. An electrically conductive first layer region is arranged at the substrate, wherein the layer thickness of the first layer region is greater than 10 micrometers or greater than 50 micrometers.
Claims16
A method for producing an electronic device comprising:
- connecting a carrier slice to a workpiece slice;
- thinning the workpiece slice;
- applying an electrically conductive first layer to the thinned workpiece slice;
- releasing the carrier slice after applying the first layer and, using the first layer as a carrier;
- and
- singulating components by separation, wherein both the workpiece slice and the first layer are severed and the first layer is used as a contact for the workpiece slice.
3 more elements
A method comprising:
- singulating components, wherein a workpiece slice and a first layer arranged at the workpiece slice are severed in mutually different separating operations, and wherein the workpiece slice is thinned such that its thickness is one third or less than the thickness of the first layer.
Dependencies are inferred from the claim text.