Micro-embossing fabrication of electronic devices
AssigneeSeiko Epson Corporation
InventorsShunpu Li, Christopher Newsome, David Russell, Thomas Kugler
Life of this patent
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Abstract
A method of forming an electronic device on a substrate 10, comprising: embossing the substrate 10, surface treating the substrate so that unindented portions 11 repel a solution of a first material 60, and depositing a solution of the first material 60 in indentations 12 on the substrate 10 formed by the embossing. The substrate is then annealed so that level of the first material is the same as the surface of the substrate. The first material 60 in the indentations can then, for example, be used as the source and drain in the subsequent formation of a TFT.
Claims31
A method of forming an electronic device on a substrate, comprising:
- embossing the substrate;
- depositing a solution of a first material in indentations on the substrate formed by the embossing;
- evaporating the solution of the first material, the first material being provided in the indentations;
- and
- annealing the substrate.
A method of forming a device, the method comprising:
- forming a first indent portion, a second indent portion and an unindented portion in a substrate by embossing the substrate, the unindented portion being positioned between the first indent portion and the second indent portion, a surface of the first indent portion being apart from a surface of the unindented portion by a first distance;
- depositing a solution of a material on the first indent portion and the second indent portion;
- and
- annealing the substrate such that the first distance is reduced.
Dependencies are inferred from the claim text.