Solid-state imaging device and method of manufacturing said solid-state imaging device
AssigneeFUJIFILM Corporation
InventorsHiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Abstract
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
Claims11
A method of manufacturing a solid-state imaging device, comprising the steps of:
- forming a plurality of IT-CCDs on a surface of a semiconductor substrate;
- bonding a translucent member having a through hole filled with a conductive material on the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD;
- and
- isolating a bonded member obtained at the bonding step for every IT-CCD,
- wherein the through hole is formed to penetrate though a spacer and a sealing cover glass, and wherein an electrode fetch terminal is provided on the sealing cover glass.
A method of manufacturing a solid-state imaging device, comprising the steps of:
- forming a plurality of IT-CCDs on a surface of a semiconductor substrate;
- forming a protruded portion on the surface of the semiconductor substrate to surround a light receiving region prior to a bonding step, a gap being formed between the light receiving region and the translucent member by the protruded portion;
- bonding a translucent member having a though hole filled with a conductive material on the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD;
- and
- isolating a bonded member obtained at the bonding step for every IT-CCD,
- wherein the step of bonding a translucent member includes the steps of:
- preparing a translucent substrate having a plurality of concave portions in positions corresponding to regions in which the IT-CCDs are to be formed and a though hole in the vicinity of the concave portions;
- and
- bonding the translucent substrate to the surface of the semiconductor substrate.
Dependencies are inferred from the claim text.