Method for merging sensor field-mill and electronic lapping guide material placement for a partial mill process and sensor formed according to the method

A method for merging sensor field-mill and electronic lapping guide material placement for a partial mill process, comprising:

• forming a full film sensor over a shield and shield refill material;
• milling the sensor on a first side and a second side;
• depositing sensor refill material on the first and second sides of the sensor;
• and
• depositing an electronic lapping guide material over the sensor refill material until the electronic lapping guide material is substantially coplanar with the sensor;
• depositing photoresist over sensor material at a desired sensor location and over a the electronic lapping guide material at a desired electronic lapping guide material location to mask the desired sensor and electronic lapping guide material location;
• partially milling the sensor and the electronic lapping guide material not masked by the photoresist to form an electronic lapping guide and sensor with predetermined dimensions;
• depositing a mill refill material in the partially milled area and over the photoresist to planarize the sensor, the deposited refill material and the electronic lapping guide material;
• and
• removing the photoresist to expose the coplanar electronic lapping guide and the sensor.