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US 7,582,199 B2Granted
Plating method
AssigneeRohm and Haas Electronic Materials LLC
InventorsJacek M. Knop, John G. Carter, Donald E. Cleary
Life of this patent
Estimating the term…
Abstract
Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
Claims9
A method for depositing a metal comprising generating an electric current through an electrically conductive substrate, electrolyte and anode in electrical communication;
- and interrupting the current for an interval from 0 minutes to 5 minutes within an initial 10 minutes of a metal plating cycle with additional current interruptions of intervals from 5 seconds to 3 minutes for every 10 to 20 minutes of the metal plating cycle, the metal is chosen from copper, tin, nickel, cobalt, chromium, cadmium, lead, silver, gold, platinum, palladium, bismuth, indium, rhodium, ruthenium, iridium, zinc and alloys thereof.
Dependencies are inferred from the claim text.