Multi-pin electrical connector

An electrical pin field, comprising:

• a dielectric comprising a support member having
• a main body including a top surface, bottom surface and a plurality of through-holes formed therein,
• an o-ring groove sized and shaped for receiving an o-ring gasket,
• a protruding portion extending from said top surface, sized and shaped for preventing said electrical pin field from rotating in a housing;
• said main body having a first and second retaining portion annually disposed on an outer periphery thereof for retaining said o-ring gasket within said o-ring groove, said second retaining portion comprising a chamfered edge having a chamfered angle between fifteen and seventy degrees;
• and
• a plurality of electrically conductive pins disposed within said plurality of through-holes so as to be integrated within said support member, each of said plurality of electrically conductive pins configured to deflect in a direction toward said main body when a pushing force is applied thereto;
• wherein said plurality of electrically conductive pins include a first portion extending away from said top surface and a second portion extending away from said bottom surface, and
• said protruding portion having a plurality of non-through hole cavities formed therein, each of said plurality of non-through hole cavities axially aligned with respective ones of said through-holes and formed around a respective pin of said plurality of electrically conductive pins, said plurality of non-through hole cavities having larger diameters as compared to said plurality of through-holes.

A method for making an electrical pin field, comprising the steps of:

• constructing a mold sized and shaped to form an electrical pin field including a support member having
• a main body including a top surface, a bottom surface and a plurality of through-holes formed therein, and
• a protruding portion extending from said top surface, sized and shaped for preventing said electrical pin field from rotating in a housing, and having a plurality of non-through hole cavities formed therein, each of said plurality of non-though hole cavities axially aligned with respective ones of said through-holes and has a larger diameter as compared to each of said plurality of through-holes;
• disposing a plurality of electrically conductive pins in a pre-defined arrangement within said mold, each of said plurality of electrically conductive pins configured to deflect in a direction toward a center thereof when a pushing force is applied thereto;
• forming said support member by injecting a heated molding material into said mold;
• and
• removing said support member from said mold after a temperature of said molding material decreases, wherein said support member has said plurality of electrically conductive pins disposed within said plurality of through-holes so as to be integrated therein, and each of said non-through hole cavities is formed around a respective pin of said plurality of electrically conductive pins.