Method for preventing solder rise to electric contact and electric contact produced by the same
AssigneeFujikura Ltd.
InventorsTomonari Ohtsuki, Katsuya Yamagami
Life of this patent
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AssigneeFujikura Ltd.
InventorsTomonari Ohtsuki, Katsuya Yamagami
Estimating the term…
Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).
An electric contact connected to a copper foil by soldering so as to extend therefrom and having a portion plated with a noble metal and adapted to contact a mating object,
An electric contact connected to a copper foil by soldering so as to extend therefrom and having a portion plated with a noble metal and adapted to contact a mating object, herein said electric contact is Soldered to said copper foil in a manner that said portion of said electric contact adapted to contact the mating object is cooled by cooling means in contact with at least said portion of the electric contact, while a connection portion between said electric contact and said copper foil is heated by heating means, and a shape of part of said cooling means to contact said portion of said electric contact adapted to contact the mating object is concave to be commensurate with said portion of said electric contact.
A method for preventing solder from rising to a portion of an electric contact when said electric contact is being soldered to a copper foil so as to extend therefrom, said portion being plated with a noble metal and adapted to contact a mating object, wherein cooling means is brought into contact with at least said portion of the electric contact adapted to contact said mating object, and connection portion between said electric contact and said copper foil is heated by heating means.
Dependencies are inferred from the claim text.