US 7,581,878 B2Granted

Measuring system and screening method for thermal conductive efficiencies of thermal conductive devices

AssigneeYeh-Chiang Technology Corp.

InventorsKe-Chin Lee, Chen-Chuan Lin, Chi-Te Chin, Li-Kai Wu

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Abstract

The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Claims13

Dependent claims

A measuring system (1) for determining the approximate maximum thermal conductive capability (Qmax) of a thermal conductive device (10), the thermal conductive device (10) to be measured comprising a heating terminal (10a) and a heat dissipating terminal (10c), the measuring system (1) comprising:

a heating module (80), comprising a metal heated block (20) located at the heating terminal (10a) of the thermal conductive device (10), a heating rod (25) used for heating the metal heated block (20) to a predetermined temperature, and a heat insulating pressure device (30′) used for applying a pressure relatively to and covering the surface of the heating terminal (10a);
a heat dissipating module (90), located at the heat dissipating terminal (10c) of the thermal conductive device (10), wherein a cooling device (40) cools the heat dissipating terminal (10c) and a cooling pressure device (40′) applies a pressure relatively to and is joined to the surface of the heat dissipating terminal (10c);
a temperature extraction interface module (50), for extracting corresponding temperature values of the metal heated block (20) varying with time during cooling;
and
a calculation module (60) which obtains a maximum temperature drop of the metal heated block (20) in a specific interval of the cooling period from the values extracted by the temperature extraction interface module (50) from which a simulation heat dissipated quantity (Q) is obtained and compared with a database to obtain the approximate maximum thermal conductive capability (Qmax) of the thermal conductive device (10).

2 more elements

A screening method for determining the approximate maximum thermal conductive capability (Qmax) of a thermal conductive device, applied for rapidly measuring the capability of thermal conductive device (10), the thermal conductive device (10) comprising a heating terminal (10a) and a heat dissipating terminal (10c), the method comprising the steps of:

step 1:
fixing the heating terminal (10a) of the thermal conductive device (10) to be measured on a heating module (80), and fixing the other heat dissipating terminal (10c) on a heat dissipating module (90);
step 2:
heating a metal heated block (20) on the heating module (80) to a specific temperature and to reach a static state;
step 3:
stopping the heating, and cooling the metal heated block (20) by the thermal conduction of the thermal conductive device (10);
step 4:
measuring and extracting corresponding values of temperature and time from the heated block (20) during cooling;
step 5:
finding a maximum temperature drop of the metal heated block (20) in a specific interval of the cooling period, so as to obtain a simulation heat dissipating quantity (Q);
and
step 6:
comparing the simulation heat dissipating quantity (Q) with a database to find out an approximate maximum thermal conductive capability (Qmax) of the thermal conductive device 10.

10 more elements

Dependencies are inferred from the claim text.