Method and device for reflow soldering with volume flow control
AssigneeRehm Thermal Systems GmbH
InventorHans Bell
Life of this patent
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Abstract
According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.
Claims9
A method of soldering an item to be soldered in a transit oven comprising:
- heating the item to be soldered in a preheating zone using a preheating device to a first temperature below the melting temperature of a solder in contact with the item to be soldered;
- subjecting the item to be soldered in a soldering zone with a first volume flow of a fluid with a second temperature higher than a melting temperature of the solder generated by a convection heater;
- after subjecting the item to be soldered with the first volume flow, subjecting the item to be soldered in the soldering zone with a second volume flow of a fluid with the second temperature, and
- cooling the item to be soldered below the melting temperature,
- wherein the first volume flow is larger than the second volume flow, and
- wherein the convection heater heats the item to be soldered from both sides with the first and second volume flows at the second temperature.
Dependencies are inferred from the claim text.