Variable position cooling apparatus

An article for cooling a heat-dissipating component comprising:

• a substrate;
• a movable member movable between a first position proximate said substrate and a second position away from said substrate;
• an expansion chamber comprising a proximal terminal end affixed to and contacting said substrate and a distal terminal end affixed to said movable member and not contacting said substrate, wherein said expansion chamber extends from said proximal terminal end to said distal terminal end;
• and
• a quantity of heat transfer fluid having a vapor pressure and disposed within said expansion chamber;
• wherein said movable member moves between said first position and said second position as said vapor pressure of said heat transfer fluid changes.

A method of cooling a heat-dissipating component having heat flux comprising:

• providing an expansion chamber comprising a quantity of heat transfer fluid having a vapor pressure, and at least one sidewall that is substantially impermeable to fluid, said sidewall defining an enclosed volume that is expandable between a first volume and a second volume, said sidewall comprising a proximal terminal end affixed to and contacting said substrate, a distal terminal end opposite said proximal terminal end and not contacting said substrate, an inner surface proximate said enclosed volume, and an outer surface opposite said inner surface, wherein said sidewall extends between said proximal terminal end and said distal terminal end;
• increasing the vapor pressure of said heat transfer fluid by heating said heat transfer fluid with said heat-dissipating component;
• and
• moving said distal terminal end from a first position proximate said substrate to a second position away from said substrate by expanding said enclosed volume from said first volume to said second volume.