Sensor and manufacturing method of sensor
AssigneeNagano Keiki Co., Ltd.
InventorsYukinobu Iimori, Nobuaki Yamada, Shuji Tohyama, Takayuki Yokoyama
Life of this patent
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Abstract
A pressure sensor is provided with a cap on a measuring portion of a diaphragm to which a first end of a flexible board is connected while a second end of the flexible board is connected to a circuit board spaced apart from the diaphragm. The flexible board is provided with the first end, a belt portion that is bent at an angle of ninety degrees or more relative to the first end in a direction to be away from the circuit board and is curved along the outer circumference of the diaphragm, and the second end that is bent at an angle of ninety degrees or more relative to the belt portion to be connected to the circuit board.
Claims7
A sensor, comprising:
- a sensor element having a measuring portion;
- a cap provided on the measuring portion of the sensor element;
- and
- a flexible board, wherein
- the flexible board has a first end connected to a flat side of the cap, a belt portion that is bent away from a circuit board spaced apart from the sensor element at an angle of ninety degrees or more relative to the first end and is curved along and spaced away from an outer circumference of the sensor element, and a second end that is bent at an angle of ninety degrees or more relative to the belt portion to be connected with the circuit board.
A method for manufacturing a sensor, the method comprising the steps:
- providing:
- a sensor element having a measuring portion,
- a cap, and
- a flexible board having a first end, a belt portion, and a second end;
- attaching the cap on the sensor element;
- connecting the first end of the flexible board to the cap;
- bending the belt portion by an angle of ninety degrees or more relative to the first end to be curved along and spaced away from an outer circumference of the sensor element;
- and
- bonding the second end to a circuit board.
Dependencies are inferred from the claim text.