Temperature compensating pressure sensing arrangement

Abstract

The invention provides for a temperature compensating pressure sensing arrangement. The arrangement includes a substrate having sealed channels on which is deposited a CMOS layer, with a conductive layer and a passivation layer deposited on the CMOS layer. The arrangement also includes a conductive active membrane spaced from the conductive layer to form an active chamber, and a conductive reference membrane spaced from the conductive layer to form a sealed reference chamber. Further included is a cap which covers the membranes, said cap exposing the active membrane to an outside fluid pressure. The active membrane further defines a foot which is located between the substrate and cap with a leg extending away from the substrate and terminating in a substantially planar deflectable portion, which deflects due to differential pressure stresses so that an active capacitance is developed between the active membrane and the conductive layer depending on the electrical permittivity e of the fluid. The reference membrane provides a temperature compensating reference capacitance. The arrangement also has sensor circuitry configured to determine a charge imbalance indicative of a pressure difference between the active and reference membranes.

Dependencies are inferred from the claim text.