Substrate drying processing apparatus, method, and program recording medium

A substrate processing system comprising:

• a cleaning tank to receive a workpiece and to clean the workpiece;
• a drying tank to receive the workpiece and to dry the cleaned workpiece received therein;
• a fluid supply mechanism joined to the drying tank to supply a carrier gas and a dry vapor into the drying tank;
• and
• a control device for controlling a supply of the carrier gas and a supply of the dry vapor by the fluid supply mechanism to dry the workpiece placed in the diying tank such that a carrier gas supply step of supplying the carrier gas while stopping the supply of the dry vapor and a mixed fluid supply step of supplying the carrier gas while supplying the dry vapor are executed alternately and continuously to supply the carrier gas continuously and to supply the dry vapor intermittently, and such that a total mixed fluid supply time for which the mixed fluid supply step is executed is not shorter than 57% of a total processing time for which the carrier gas supply step and the mixed fluid supply step are executed.

A substrate drying method comprising the steps of:

• placing a workpiece in a processing tank;
• and
• drying the workpiece by intermittently supplying a mixed fluid including a carrier gas and a dry vapor into the processing tank in which the workpiece is placed;
• wherein the step of drying the workpiece includes a carrier gas supply step of supplying the carrier gas while stopping the supply of the dry vapor, and a mixed fluid supply step of supplying the carrier gas while supplying the dry vapor,
• the carrier gas supply step and the mixed fluid supply step are executed, alternately and continuously so as to supply the carrier gas continuously and so as to supply the dry vapor intermittently, and
• a total mixed fluid supply time for which the mixed fluid supply step is executed is not shorter than 57% of a total processing time for which the carrier gas supply step and the mixed fluid supply step are executed.

A substrate processing method comprising the steps of:

• placing a workpiece in a cleaning tank;
• cleaning the workpiece placed in the cleaning tank;
• placing the cleaned workpiece in a drying tank;
• and
• drying the workpiece by intermittently supplying a mixed fluid including a carrier gas and a dry vapor into the drying tank in which the workpiece is placed;
• wherein the step of drying the workpiece includes a carrier gas supply step of supplying the carrier gas while stopping the supply of the dry vapor, and a mixed fluid supply step of supplying the carrier gas while supplying the dry vapor,
• the carrier gas supply step and the mixed fluid supply step are executed alternately and continuously so as to supply the carrier gas continuously and so as to supply the dry vapor intermittently, and
• a total mixed fluid supply time for which the mixed fluid supply step is executed is not shorter than 57% of a total processing time for which the carrier gas supply step and the mixed fluid supply step are executed.

A storage medium storing a program to be carried out by a control device for controlling a drying apparatus including a processing tank to receive a workpiece, and a fluid supply mechanism to supply a carrier gas and a dry vapor into the processing tank;

• said control device being capable of carrying out the program to accomplish a substrate drying method including the steps of:
• placing a workpiece in the processing tank;
• and
• drying the workpiece by intermittently supplying a mixed fluid including a carrier gas and a dry vapor into the processing tank in which the workpiece is placed;
• wherein the step of drying the workpiece includes a carrier gas supply step of supplying the carrier gas while stopping the supply of the dry vapor and a mixed fluid supply step of supplying the carrier gas while supplying the dry vapor, the carrier gas supply step and the mixed fluid supply step are executed, alternately and continuously so as to supply the carrier gas continuously and so as to supply the dry vapor intermittently, and a total mixed fluid supply time for which the mixed fluid supply step is executed is not shorter than 57% of a total processing time for which the carrier gas supply step and the mixed fluid supply step are executed.