Calibration device for nozzle and calibration method for nozzle
AssigneeUnited Microelectronics Corp.
InventorsWai Keong Alvin Wong, Tien Ching Ting, Yong-An Lin, Jin Seng Chan
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AssigneeUnited Microelectronics Corp.
InventorsWai Keong Alvin Wong, Tien Ching Ting, Yong-An Lin, Jin Seng Chan
Estimating the term…
A calibration device for a nozzle suitable for calibrating a nozzle of a semiconductor apparatus is provided. The semiconductor apparatus includes a chuck with a center hole with radius R1. A cap with outer radius R3 is disposed outside the nozzle with outer radius R2. The calibration device includes a jig including an upper portion, a lower portion and a recess in the front surface of the upper portion. The recess includes an outer portion with depth D1 and radius R4 larger than R3 and an inner portion with depth D2 larger than D1 and radius R5 larger than R2. The lower portion with a radius R6 less than R1 is connected to the back surface of the upper portion for fixing the jig in the center hole. The values of (R4−R3), (R5−R2) and (R1−R6) are in the tolerable calibration inaccuracy range.
A calibration device for a nozzle, suitable for calibrating a nozzle of a semiconductor apparatus, wherein the semiconductor apparatus comprises a chuck having a center hole with a radius R1, a cap with an outer radius R3 is disposed outside the nozzle with an outer radius R2, and the calibration device comprising a jig, wherein the jig comprises:
A calibration method for a nozzle, suitable for calibrating a nozzle of a semiconductor apparatus, comprising:
Dependencies are inferred from the claim text.
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Measuring instruments characterised by the use of mechanical techniques: ring or other apertured gauges, e.g. "go/no-go" gauge
Measuring instruments characterised by the use of mechanical techniques: plug gauges for internal dimensions with engaging surfaces which are at a…
Measuring arrangements characterised by the use of electric or magnetic techniques: for measuring distance or clearance between spaced objects or…
For measuring angles or tapers; for testing the alignment of axes: for testing the alignment of axes
About 1 year 4 months of term left · ends 29 Feb 2028 (estimated)
1. Field of the Invention
The present invention relates to a calibration device for a semiconductor apparatus and a calibration method for a semiconductor apparatus, and more particularly to a calibration device for a nozzle and a calibration method for a nozzle.
2. Description of Related Art
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
FIG. 1 is a cross-sectional view of a calibration device according to a first embodiment of the present invention.
FIGS. 2A to 2C are cross-sectional views of a flow of a calibration method for a nozzle performed by the calibration device according to the first embodiment of the present invention.
FIG. 1 is a cross-sectional view of a calibration device according to a first embodiment of the present invention.
Referring to FIG. 1, the calibration device is suitable for calibrating a nozzle 202 of a semiconductor apparatus 200. The semiconductor apparatus 200 includes a chuck 204 having a center hole 206 with a radius R1. A cap 208 is disposed outside the nozzle 202. Wherein, the nozzle 202 has an outer radius R2, and the cap 208 has an outer radius R3. The semiconductor apparatus 200 is, for example, a photoresist spinner and a washing bench. In the first embodiment, the cap 208 protrudes out of the nozzle 202 about 1 mm, for example.
The calibration device includes a jig 100. The jig 100 includes an upper portion 102 and a lower portion 104. The jig 100 includes a recess 106 in the front surface of the upper portion 102. The recess 106 includes an outer portion 108 and an inner portion 110. The outer portion 108 has a depth D1 and a radius R4 larger than R3, and the value of (R4−R3) is in a tolerable calibration inaccuracy range. The inner portion 110 has a depth D2 larger than D1 and a radius R5 larger than R2, and the value of (R5−R2) is in a tolerable calibration inaccuracy range. Under the limitations of the aforementioned radiuses, the nozzle 202 and the cap 208 can be received in the recess 106, without causing the calibration inaccuracy value to go beyond a tolerable inaccuracy range.