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US 7,581,313 B2Granted
Component mounting method and mounter
AssigneePanasonic Corporation
InventorsEiichi Hachiya, Tamaki Ogura
Life of this patent
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AssigneePanasonic Corporation
InventorsEiichi Hachiya, Tamaki Ogura
Estimating the term…
The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (105); a recognition unit (108) including a shutter camera (111b) and instructing it to start taking an image of a component (103a) when the mounting head (105) arrives at a predetermined position; and a main control unit (160) (i) correcting a position of the component shown in the image taken by the shutter camera (111b), based on a first distance over which the mounting head (105) moves during a time period from when the instruction to start taking the image is given to when camera exposure by the shutter camera (111b) is performed, (ii) correcting the mounting position at which the mounting head (105) is to mount the component (103a), based on the corrected component position, and (iii) controlling the mounting head (105) so that it mounts the component (103a) at the corrected mounting position.
A component mounting method for use by a mounter having a mounting head that holds and moves a component so as to mount the component onto a board, said method comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling…
Electrical device making: including measuring or testing of device or component part
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.
Assembling to base an electrical component, e.g., capacitor, etc.: by utilizing optical sighting device
Term ended 6 Oct 2026 (estimated)
The present invention relates to a component mounting method and a mounter, and particularly to a component mounting method and a mounter for correcting a mounting position at which a component is to be mounted at the time of component mounting.
A component mounting apparatus (mounter) is one of the conventional apparatuses that mount electronic components (hereinafter simply referred to also as “component(s)”) onto a board. In a component mounting apparatus, a mounting head picks up a component from a component supply apparatus such as a tape feeder, and delivers and mounts such component onto a board. In response to the demand for improved accuracy in the component mounting performed by such component mounting apparatus, there exists a component mounting apparatus which is equipped with a recognizing means that recognizes the state of a component held on a mounting head and which corrects the mounting position at which the component is to be mounted at the time of component mounting (such position is hereinafter simply referred to also as a “mounting position”), based on the result of the recognition performed by the recognizing means.
FIG. 1 is an external view showing a conventional electronic component mounting apparatus (e.g., refer to Japanese Laid-Open Patent application No. 10-256790).
These and other objects, advantages and features of the invention will become apparent from the following description thereof taken in conjunction with the accompanying drawings that illustrate a specific embodiment of the invention. In the Drawings:
FIG. 1 is an external view showing a conventional electronic component mounting apparatus;
FIG. 2 is a timing chart showing operations, for recognizing a component, performed by a recognizing means of the conventional electronic component mounting apparatus;
The following describes the mounter according to an embodiment of the present invention with reference to the drawings.
FIG. 4 is an external view showing the mounter of the present embodiment.
The mounter 101 is comprised of: a transportation path 102 for transporting a board 102a and determining the position thereof; a tray 103 on which components 103a are stored; a tray feeder 104 serving as a component supply unit for automatically delivering a tray 103 to a predetermined position; a mounting head 105 for picking up by suction a component 103a from the tray 103 and mounting it onto the board 102a; an X-axis moving unit 106 for moving the mounting head 105 along the X-axis direction; and Y-axis moving units 107a and 107b for moving the mounting head 105 along the Y-axis direction; and a recognition unit 108 for recognizing the state of the component 103a held on the mounting head 105.