Method for manufacturing multilayer flexible printed circuit board

#1. Technical Field

#The present invention relates to a method for manufacturing a flexible printed circuit board, and especially to a method for manufacturing a multilayer flexible printed circuit board having different number of layers in different areas.

#2. Discussion of Related Art

#Many aspects of the present invention can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present invention.

#FIG. 1 is a flow chart shows a method for manufacturing a multilayer FPCB having different number of layers in different areas;

#FIGS. 2 to 12 are schematic views show a process for manufacturing a multilayer FPCB having different number of layers in different areas in accordance with first preferred embodiment;

#Referring to FIG. 1, a method for manufacturing a multilayer FPCB having different number of layers in different areas includes the steps in no particular order of:

#providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening in the binder layer; defining a first slit in the first copper clad laminate; laminating the first copper clad laminate and the second copper clad laminate on opposite sides of the binder layer; forming a via hole for establishing an electric connection between the first copper clad laminate and the second copper clad laminate; and defining a second slit in the first copper clad laminate.

#The method will be discussed in detail with the following preferred embodiments: