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US 7,578,712 B2Granted
Contact spring assembly for electronic devices
AssigneeChi Mei Communication Systems, Inc.
InventorCheng-Lung Chang
Life of this patent
Estimating the term…
Abstract
A contact spring assembly (30) for an electronic device includes a mounting portion (31), a press spring (32), and a deformable spring (37). The press spring and the deformable spring are respectively bent from the mounting portion. The press spring resists the deformable spring. The press spring is configured to be moved along a first direction and push the deformable spring to move along a second direction different from the first direction.
Claims14
A contact spring assembly for an electronic device, comprising:
- a mounting portion configured to be mounted on the electronic device;
- a resiliently depressible press spring bent from the mounting portion;
- and
- a deformable spring bent from the mounting portion, the deformable spring including a first resilient arm, a second resilient arm, and a contacting foot the first resilient arm being bent from the mounting portion, the second resilient arm being bent from the first resilient arm, the electrical connection to a printed circuit beard of the electronic device;
- wherein the press spring resiliently depressibly resists the deformable spring, the press spring being configured to be moved along a first direction thereby pushing the deformable spring to move along a second direction different from the first direction.
2 more elements
Dependencies are inferred from the claim text.