Bond capillary design for ribbon wire bonding
AssigneeTexas Instruments Incorporated
InventorsBernhard P. Lange, Steven A. Kummerl
Life of this patent
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AssigneeTexas Instruments Incorporated
InventorsBernhard P. Lange, Steven A. Kummerl
Estimating the term…
A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.
A device for bonding a ribbon wire to a workpiece, the device comprising:
Dependencies are inferred from the claim text.