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US 7,576,439 B2Granted
Electrically connecting substrate with electrical device
AssigneeHewlett-Packard Development Company, L.P.
InventorsDavid M. Craig, Chien-Hua Chen
Life of this patent
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Abstract
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
Claims17
A packaged semiconductor device comprising:
- a substrate having one or more first bonding pads;
- an electrical device mounted on the substrate and having one or more second bonding pads corresponding to the first bonding pads of the substrate;
- and,
- one or more wires, each wire electrically connecting a first bonding pad with a second bonding pad, a first end of the wire ball bonded to the first bonding pad and a second end of the wire bonded to the second bonding pad, the wire having a reverse-motion loop, such that as connected between the first bonding pad and the second bonding pad, the wire extends straight upwards from the first bonding pad, then upwards and away from the second bonding pad, and finally downwards and towards the second bonding pad where the wire contacts the second bonding pad.
1 more element
A packaged semiconductor device comprising:
- a substrate having one or more first bonding pads;
- an electrical device mounted on the substrate and having one or more second bonding pads corresponding to the first bonding pads of the substrate;
- and,
- means for electrically connecting each first bonding pad with one of the second bonding pads via a ball bond at the first bonding pad, the means comprising one or more wires,
- wherein as connected between a first bonding pad and a second bonding pad, each wire extends straight upwards from the first bonding pad, then upwards and away from the second bonding pad, and finally downwards and towards the second bonding pad where the wire contacts the second bonding pad.
2 more elements
An electronic device comprising:
- a packaged semiconductor device having a substrate on which a micro electro-mechanical system (MEMS) device is mounted, one or more first bonding pads of the substrate electrically connected to one or more second bonding pads of the MEM device via one or more wires having reverse-motion loops, a first end of each wire ball bonded to a first bonding pad and a second end of the wire bonded to a second bonding pad;
- and,
- a controller to control the MEMS device of the packaged semiconductor device to provide a predetermined functionality,
- wherein as connected between a first bonding pad and a second bonding pad, each wire extends straight upwards from the first bonding pad, then upwards and away from the second bonding pad, and finally downwards and towards the second bonding pad where the wire contacts the second bonding pad.
1 more element
Dependencies are inferred from the claim text.