EMI shielded semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsSang Jin Cha, Hyeongno Kim
Life of this patent
Estimating the term…
Abstract
An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of bonding wires. At least one shielding conductive block is formed on the substrate and electrically connected to the ground trace of the substrate. A sealant is formed on the substrate and covers the chip, bonding wires and the shielding conductive block. The sealant has a side surface to expose a surface of the shielding conductive block. A layer of conductive film is formed on the outer surface of the sealant and covers the exposed surface of the shielding conductive block thereby shielding the chip from electromagnetic interference.
Claims9
A semiconductor package, comprising:
- a substrate having a ground trace;
- a chip disposed on the substrate;
- at least one shielding conductive block formed on the substrate and electrically connected to the ground trace;
- a sealant formed on the substrate and covering the chip and shielding conductive block, the sealant having a side surface to expose a surface of the shielding conductive block;
- and
- a conductive film formed on the outer surface of the sealant and covering the exposed shielding conductive block to electrically connect to the shielding conductive block.
A method for manufacturing a semiconductor package, comprising the steps of:
- providing a substrate strip comprising a plurality of substrate units, wherein the substrate units are separated from each other by a plurality of saw streets, each of the substrate units has a ground trace;
- disposing a plurality of chips on the substrate units;
- forming a plurality of shielding conductive blocks across the saw streets of the substrate strip and electrically connecting the shielding conductive blocks to the ground traces;
- forming a continuous sealant on the substrate strip to encapsulate the chips and shielding conductive blocks;
- cutting the continuous sealant along the saw streets to form a plurality of separated sealants and to have each of the shielding conductive blocks divided into two halves, wherein each of the separated shielding conductive blocks has a surface exposed out of the separated sealant;
- forming a layer of conductive film on the outer surfaces of the sealants to cover the exposed surfaces of the shielding conductive blocks so as to electrically connect the conductive film to the separated shielding conductive blocks;
- and
- cutting the substrate strip to fully separate the substrate units from each other.
Dependencies are inferred from the claim text.