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US 7,571,529 B2Granted
Method for forming an electronic device in multi-layer structure
AssigneesCambridge University Technical Services Limited, Eidgenossische Technische Hochschule Zurich
InventorsHenning Sirringhaus, Richard Henry Friend, Natalie Stutzmann, Paul Smith
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Abstract
A method for forming an organic or partly organic switching device, comprising: depositing layers of conducting, semiconducting and/or insulating layers by solution processing and direct printing; defining microgrooves in the multilayer structure by solid state embossing; and forming a switching device inside the microgroove.
Claims58
A method for forming an electronic switching device in a multi-layer structure comprising at least a first layer and an underlying second layer, the method comprising:
- forcing a microcutting protrusion of a cutting tool into the multi-layer structure so as to cause the protrusion to microcut through the first layer and into the second layer;
- and
- wherein the microcut first layer forms at least one electrode of said electronic switching device,
- wherein the second layer is in the solid state while the forcing step is performed, and
- wherein the electronic switching device comprises a semiconducting material between source and drain electrodes, and wherein the microcutting serves to define an edge adjacent to the semiconducting material of at least one of said source and drain electrodes.
2 more elements
Dependencies are inferred from the claim text.