Manufacturing method of silicon wafer
AssigneeSumitomo Mitsubishi Silicon Corporation
InventorsShigeru Umeno, Masataka Hourai, Masakazu Sano, Shinichiro Miki
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Abstract
An active layer side silicon wafer is heat-treated in an oxidizing atmosphere to thereby form a buried oxide film therein. The active layer side silicon wafer is then bonded to a supporting side wafer with said buried oxide film interposed therebetween thus to fabricate an SOI wafer. Said oxidizing heat treatment is carried out under a condition satisfying the following formula: [Oi]≦2.123×1021exp(−1.035/k(T+273)), where, T is a temperature of the heat treatment, and [Oi] (atmos/cm3) is an interstitial oxygen concentration.
Claims12
A manufacturing method of a silicon wafer not including COP comprising:
- preparing a silicon single crystal by the Czochralski method,
- slicing a first silicon wafer from said silicon single crystal to obtain a silicon wafer including COP,
- heat-treating said silicon wafer including COP in an oxidizing atmosphere to obtain the silicon wafer not including COP, wherein
- assuming that a temperature at which said heat treatment is carried out in said oxidizing atmosphere is denoted as T (° C.) and an interstitial oxygen concentration in said silicon water including COP is denoted as [Oi](atoms/cm3), said manufacturing method of the silicon wafer characterized in that a relation between said temperature T and said interstitial oxygen concentration [Oi] satisfies the following formula:
- [Oi]≦2.123×1021exp(−1.035/k(T+273)),
- where, said interstitial oxygen concentration in said silicon wafer including COP is a value measured in accordance with FT-IR method (ASTM F-121, 1979) and the k is the Boltzmann's constant, 8.617×10−5 (eV/K).
A manufacturing method of a SOI wafer, in which a buried oxide film is formed by applying a heat treatment to an active layer side silicon wafer including COP in an oxidizing atmosphere, to obtain an active layer side silicon wafer not including COP, and said active layer side silicon wafer not including COP is then bonded to a supporting side wafer with said buried oxide layer interposed therebetween thus to manufacture a bonded SOI wafer, wherein
- assuming that a temperature at which said heat treatment is applied to said active layer side silicon wafer including COP in said oxidizing atmosphere is denoted as T(° C.) and an interstitial oxygen concentration of said active layer side silicon wafer including COP is denoted as [Oi] (atoms/cm3), said manufacturing method of the SOI wafer characterized in that a relation between said heat treatment temerature T and said interstitial oxygen concentration [Oi] of said active layer side silicon wafer satisfies the following formula:
- [Oi]≦2.123×1021exp(−1.035/k(T+273)),
- where, said interstitial oxygen concentration is a value measured in accordance with FT-IR method (ASTM F-121, 1979) and the k is the Boltzmann's constant, 8.617×10−5 (eV/K).
A manufacturing method of a SOI wafer, in which an active layer side silicon wafer including COP is bonded to a supporting side wafer with an insulating film interposed therebetween and then a heat treatment for enhancing a bonding strength is applied to thus bonded wafer in an oxidizing atmosphere to thereby manufacture a bonded SOI wafer, wherein
- assuming that a temperature at which said heat treatment for enhancing the bonding strength is carried out in said oxidizing atmosphere is denoted as T(° C.) and an interstitial oxygen concentration of said active layer side silicon wafer including COP is denoted as [Oi] (atoms/cm3), said manufacturing method of the SOI wafer characterized in that a relation between said temperature T and said interstitial oxygen concentration [Oi] satisfies the following formula:
- [Oi]≦2.123×1021exp(−1.035/k(T+273)),
- where, said interstitial oxygen concentration of said active layer side silicon wafer including COP is a value measured in accordance with FT-IR method (ASTM F-121, 1979) and the k is the Boltzmann's constant, 8.617×10−5 (eV/K).
A manufacturing method of a SOI wafer, comprising the steps of:
- fabricating an active layer side silicon wafer not including COP by firstly applying an oxidizing heat treatment to a silicon wafer,including COP, which satisfies the following formula representing a relation between a heat treatment temperature T and an interstitial oxygen concentration [Oi]of the silicon wafer including COP:
- [Oi]≦2.123×1021exp(−1.035/k(T+273)),
- where, T(° C.) is the temperature at which said heat treatment is carried out in an oxidizing atmosphere, and [Oi] (atoms/cm3) is the interstitial oxygen concentration in the silicon wafer, including COP, wherein said interstitial oxygen concentration of the silicon wafer including COP is a value measured in accordance with FT-IR method (ASTM F-121, 1979) and the k is the Boltzmann's constant, 8.617×10−5 (eV/K), and by secondly removing an oxide film and applying a mirror-polishing;
- forming an ion implanted layer in said active layer side silicon wafer not including COP by forming an oxide film on said active layer side silicon wafer, and ion-implanting via said oxide film;
- subsequently, forming a bonded wafer by bonding the active layer side silicon wafer having the ion implanted layer to a supporting side wafer with said oxide film interposed therebetween;
- and
- then, separating a part of said active layer side silicon wafer from a boundary defined by said ion implanted layer by holding said bonded wafer at a predetermined temperature to thereby apply a heat treatment thereto.
Dependencies are inferred from the claim text.