Integrated circuit package, panel and methods of manufacturing the same
AssigneeInfineon Technologies AG
InventorChee Chian Lim
Life of this patent
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Abstract
A method of manufacturing an integrated circuit package includes: assembling a composite wafer including alternating rows or columns of first and second strips on an adhesive tape, the first strips including a plurality of first dies and the second strips including a plurality of second dies, singulating the first dies from the first strips and the second dies from the second strips, forming a bond wire between respective ones of the first dies and respective ones of the second dies, thereby forming a plurality of component, embedding the components in mold compound, thereby forming a panel and separating the components from the panel, thereby forming individual integrated circuit packages.
Claims9
A method of manufacturing an integrated circuit package, the method comprising:
- providing a first integrated circuit wafer including a plurality of first integrated circuit dies;
- providing a second integrated circuit wafer including a plurality of second integrated circuit dies;
- singulating the first wafer into first strips, each first strip including a plurality of first dies;
- singulating the second wafer into second strips, each second strip including a plurality of second dies;
- assembling a composite wafer by interleaving first and second strips on an adhesive tape;
- singulating the first dies from the first strips and singulating the second dies from the second strips;
- forming bond wires between respective ones of the first dies and respective ones of the second dies to form a plurality of components;
- encapsulating the plurality of components in a mold compound, thereby forming a panel;
- and
- singulating the components from the panel thereby forming at least one integrated circuit package.
Dependencies are inferred from the claim text.